ADVANCED ELECTRONICS TECHNOLOGIES
Abstract
The Advanced Electronics Technologies program element is budgeted in the Advanced Technology Development Budget Activity because it seeks to design and demonstrate state-of-the-art manufacturing and processing technologies for the production of various electronics and microelectronic devices, sensor systems, actuators and gear drives that have military applications and potential commercial utility. Introduction of advanced product design capability and flexible, scalable manufacturing techniques will enable the commercial sector to rapidly and cost-effectively satisfy military requirements. The MicroElectroMechanical Systems (MEMS) and Integrated Microsystems Technology project is a broad, cross-disciplinary initiative to merge computation and power generation with sensing and actuation to realize a new technology for both perceiving and controlling weapons systems and battlefield environments. MEMS applies the advantages of miniaturization, multiple components and integrated microelectronics to the design and construction of integrated electromechanical and electro-chemical-mechanical systems to address issues ranging from the scaling of devices and physical forces to new organization and control strategies for distributed, high-density arrays of sensor and actuator elements. The project will also address thermal management, navigation and positioning technology challenges. The Mixed Technology Integration project funds advanced development and demonstrations of selected basic and applied electronics research programs. Examples of activities funded in this project include, but are not limited to: (1) component programs that integrate mixed signal (analog and digital; photonic and electronic) or mixed substrate (Gallium Nitride, Gallium Arsenide, Indium Phosphide, or Silicon Germanium with CMOS) technology that will substantially improve the capability of existing components and/or reduce size, weight and power requirements to a level compatible with future warfighter requirements; (2) development and demonstration of brassboard system applications in such areas as laser weaponry or precision navigation and timing to address mid-term battlefield enhancements; and (3) novel technological combinations (i.e. photonics, magnetics, frequency attenuators) that could yield substantial improvement over current systems.
Document Details
- Document Type
- R2 Budgetary Justification
- Publication Date
- Oct 01, 2016
- Source ID
- 0603739E_3_0400_PB_2016
- Change Summary Explanation
- FY 2014: Decrease reflects below threshold and omnibus reprogrammings and the SBIR/STTR transfer. FY 2016: Decrease reflects completion of the MEMS and Integrated Microsystems Technology Project (MT-12).
- Service Agency Name
- Defense Advanced Research Projects Agency
Entities
Organizations
- Defense Advanced Research Projects Agency
Related Documents
- Child Project: MEMS AND INTEGRATED MICROSYSTEMS TECHNOLOGY
- Child Accomplishment: Micro-Technology for Positioning, Navigation, and Timing (Micro PN&T)
- Child Accomplishment: Blast Exposure Accelerated Sensor Transfer (BEAST)
- Child Project: MIXED TECHNOLOGY INTEGRATION
- Child Accomplishment: Endurance
- Child Accomplishment: Diverse & Accessible Heterogeneous Integration (DAHI)
- Child Accomplishment: FLASH - Scaling Fiber Arrays at Near Perfect Beam Quality
- Child Accomplishment: Direct SAMpling Digital ReceivER (DISARMER)
- Child Accomplishment: Photonic Radio
- Child Accomplishment: Fast and Big Mixed-Signal Designs (FAB)
- Child Accomplishment: Precise Robust Inertial Guidance for Munitions (PRIGM)
- Child Accomplishment: Microwaves and Magnetics (M&M)
- Child Accomplishment: Low Cost Thermal Imager - Manufacturing (LCTI-M)