ADVANCED ELECTRONICS TECHNOLOGIES
Abstract
The Advanced Electronics Technologies Program Element is budgeted in the Advanced Technology Development Budget Activity because it seeks to design and demonstrate state-of-the-art manufacturing and processing technologies for the production of various electronics and microelectronic devices, sensor systems, integrated photonic-electronic components that have military applications and potential commercial utility. Introduction of advanced product design capability and flexible, scalable manufacturing techniques will enable the commercial sector to rapidly and cost-effectively satisfy military requirements. The Mixed Technology Integration project funds the advanced development and demonstration of selected basic and applied electronics research programs. Examples of technologies with funded development and demonstration activities include, but are not limited to: (1) self-contained laser weapon systems to protect airborne platforms from emerging surface-to-air missiles; (2) integrated photonic-electronic components for positioning, navigation and timing in GPS-denied environments; (3) flexible, software-defined cameras that enable real-time image analysis of complex scenes to provide more actionable information; and (4) component programs that integrate mixed signal (analog and digital) or mixed semiconductor technology to substantially improve the capability of existing components and/or reduce their size, weight and power. Funding under this project is intended to advance transitioning novel technologies to use, providing advanced components compatible with mid-term and other future warfighting requirements. The Beyond Scaling Advanced Technologies project is a continuation of DARPA's basic and applied research in this area and will support activities in large scale co-development with leading industry players to enable and accelerate transformative computing interactions with industry. Additionally, funding under this project will include establishing access to commercial state-of-the-art (SOTA) and state-of-the-practice (SOTP) foundries for DoD microelectronics fabrication runs, developing a manufacturable photonics and wide bandgap process, creating a microelectromechanical systems (MEMS) multi-project wafer flow, and establishing an application center to capture DoD microelectronics requirements.
Document Details
- Document Type
- R2 Budgetary Justification
- Publication Date
- Oct 01, 2020
- Source ID
- 0603739E_3_0400_PB_2020
- Change Summary Explanation
- FY 2018: Decrease reflects SBIR/STTR transfer. FY 2019: N/A FY 2020: Decrease reflects rephasing of several Mixed Technology Integration programs.
- Service Agency Name
- Defense Advanced Research Projects Agency
Entities
Organizations
- Defense Advanced Research Projects Agency
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