ADVANCED ELECTRONICS TECHNOLOGIES
Abstract
The Advanced Electronics Technologies Program Element is budgeted in the Advanced Technology Development Budget Activity because it seeks to design and demonstrate state-of-the-art manufacturing and processing technologies for the production of various electronics and microelectronic devices, sensor systems, integrated photonic-electronic components that have military applications and potential commercial utility. Introduction of advanced product design capability and flexible, scalable manufacturing techniques will enable the commercial sector to rapidly and cost-effectively satisfy military requirements. The Mixed Technology Integration project funds the advanced development and demonstration of selected basic and applied electronics research programs. Examples of technologies with funded development and demonstration activities include, but are not limited to: (1) reducing the size, weight, and power (SWaP) of components for laser weapon systems that will protect airborne platforms from emerging surface-to-air missiles; (2) integrated photonic-electronic components for positioning, navigation and timing in GPS-denied environments; (3) flexible, software-defined cameras that enable real-time image analysis of complex scenes to provide more actionable information; and (4) optical communications systems that rely on no moving parts enabling their use on SWaP-restricted platforms. Funding under this project is intended to advance transitioning novel technologies to use, providing advanced components compatible with mid-term and other future warfighting requirements. The Beyond Scaling Advanced Technologies Project is a continuation of DARPA's basic and applied research in this area and will support activities in large scale co-development with leading industry players to enable and accelerate transformative computing interactions with industry. Funding under this project will include developing new technologies and capabilities in commercial settings, establishing access to these new processes and commercial state-of-the-art (SOTA) foundries, developing manufacturable processes for integrated photonics, new architectures and integration technologies for advanced field programmable gate arrays (FPGAs), and innovating back end of line technologies for wide bandgap semiconductors.
Document Details
- Document Type
- R2 Budgetary Justification
- Publication Date
- Oct 01, 2021
- Source ID
- 0603739E_3_0400_PB_2021
- Change Summary Explanation
- FY 2019: Decrease reflects reprogrammings and the SBIR/STTR transfer. FY 2020: Decrease reflects congressional action. FY 2021: Decrease reflects completion of various Mixed Technology Integration programs in FY 2020.
- Service Agency Name
- Defense Advanced Research Projects Agency
Entities
Organizations
- Defense Advanced Research Projects Agency
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