ADVANCED ELECTRONICS TECHNOLOGIES
Abstract
The efforts described in this Program Element (PE) address the Advanced Technology Development associated with the Advanced Electronics Technologies Program that seeks to design and demonstrate state-of-the-art manufacturing and processing technologies for the production of various electronics and microelectronic devices, sensor systems, integrated photonic-electronic components that have military applications and potential commercial utility. Introduction of advanced product design capability and flexible, scalable manufacturing techniques will enable the commercial sector to rapidly and cost-effectively satisfy military requirements. The Mixed Technology Integration project funds the advanced development and demonstration of selected basic and applied electronics research programs. Examples of technologies with funded development and demonstration activities include, but are not limited to: reducing the size, weight, and power (SWaP) of components for laser weapon systems that will protect airborne platforms from emerging surface-to-air missiles; integrated photonic-electronic components for positioning, navigation and timing in GPS-denied environments; flexible, software-defined cameras that enable real-time image analysis of complex scenes to provide more actionable information; and optical communications systems that rely on no moving parts enabling their use on SWaP-restricted platforms. Funding under this project is intended to advance transitioning novel technologies to use, providing advanced components compatible with mid-term and other future warfighting requirements. The Beyond Scaling Advanced Technologies Project supports activities to enable and accelerate the transition of disruptive microelectronics advancement, including those developed under the Beyond Scaling Sciences (ES-02) and Beyond Scaling Technology (ELT-02) projects. Funding under this project will include developing new technologies and capabilities in commercial settings, establishing access to these new processes and to commercial state-of-the-art foundries, enabling prototyping, developing manufacturable processes for three-dimensional heterogeneous integration (including integrated photonics), advancing new architectures and integration technologies for advanced field programmable gate arrays (FPGAs), and innovating back end of line technologies for wide bandgap semiconductors.
Document Details
- Document Type
- R2 Budgetary Justification
- Publication Date
- Oct 01, 2024
- Source ID
- 0603739E_3_0400_PB_2024
- Change Summary Explanation
- FY 2022: Decrease reflects SBIR/STTR transfer and reprogrammings. FY 2023: N/A FY 2024: Decrease reflects completion of the Technologies for Mixed-mode Ultra Scaled Integrated Circuits (T-MUSIC) and Photonics in the Package for Extreme Scalability (PIPES) programs in FY 2023 and other program rephasings.
- Service Agency Name
- Defense Advanced Research Projects Agency
Entities
Organizations
- Defense Advanced Research Projects Agency
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