Cu Nanospring Films for Advanced Nanothermal Interfaces
Abstract
An advanced thermal interface material comprised of dense and orderly arrays of 10‐µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm2KW−1 is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jan 23, 2018
- Source ID
- 10.1002/adem.201700910
Entities
People
- David Shaddock
- Debashish Das
- Dimitrios A. Antartis
- Ioannis Chasiotis
- Ryan N. Mott
Organizations
- Air Force Office of Scientific Research
- General Electric
- University of Illinois Urbana–Champaign