Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper
Abstract
This paper reports the first integration of laser‐etched polycrystalline diamond microchannels with template‐fabricated microporous copper for extreme convective boiling in a composite heat sink for power electronics and energy conversion. Diamond offers the highest thermal conductivity near room temperature, and enables aggressive heat spreading along triangular channel walls with 1:1 aspect ratio. Conformally coated porous copper with thickness 25 µm and 5 µm pore size optimizes fluid and heat transport for convective boiling within the diamond channels. Data reported here include 1280 W cm−2 of heat removal from 0.7 cm2 surface area with temperature rise beyond fluid saturation less than 21 K, corresponding to 6.3 × 105 W m−2 K−1. This heat sink has the potential to dissipate much larger localized heat loads with small temperature nonuniformity (5 kW cm−2 over 200 µm × 200 µm with −4 of the thermal power dissipated). This breakthrough integration of functional materials and the resulting experimental data set a very high bar for microfluidic heat removal.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Oct 04, 2017
- Source ID
- 10.1002/adfm.201703265
Entities
People
- Chi Zhang
- Damena D. Agonafer
- Dan Resler
- David Altman
- Derrick Rockosi
- Farzad Houshmand
- Guoguang Rong
- Hyoungsoon Lee
- Ihor Mykyta
- James W. Palko
- Jess Moss
- Joshua D. Wilbur
- Juan Santiago
- Kenneth E. Goodson
- Mehdi Asheghi
- Tanmoy Maitra
- Tom J. Dusseault
- Yoonjin Won
Organizations
- Chung-Ang University
- Defense Advanced Research Projects Agency
- National Science Foundation
- RTX
- Stanford University
- United States Department of Energy
- University of California
- Washington University in St. Louis