Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals
Abstract
As the modern electronic technology extends into operating in harsh working conditions, it calls for a system that is capable of uncompromising performance in extreme environments, thus providing a strong motivation to look for advanced materials and electronics with the capability of high‐throughput and rapid prototyping. Coupled with additive manufacturing, molecular decomposition metals bypass the challenging oddities of traditional material‐limited and thermally initiated metalworking, enabling high throughput and rapid prototyping of stoichiometry and composition‐controlled metals. Here, a new paradigm for the design and additive manufacturing of copper metallic alloy materials onto ceramics is described by printing molecular decomposable metal materials, capable of withstanding thermo‐mechanical loading, operating in extreme environments in static and dynamic conditions. The resulting printed hybrid electronics are electrically stable for 25 h of aging at 1000 °C. This curious fact paves a way for printed antenna and sensor electronics that reliably operate up to 1000 °C. These results can be further extended to establish other printable molecular decomposable materials as a platform for rapid prototyping of high temperature electronics that are suitable for harsh environments.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Oct 20, 2023
- Source ID
- 10.1002/adfm.202311085
Entities
People
- Abdullah Islam
- Detlef Smilgies
- Firas Alshatnawi
- Jason Armstrong
- Jian Yu
- Mark Poliks
- Mohammed Alhendi
- Saurabh Khuje
- Shenqiang Ren
Organizations
- State University of New York
- United States Army Research Laboratory
- University of Maryland