In Situ Surface‐Directed Assembly of 2D Metal Nanoplatelets for Drug‐Free Treatment of Antibiotic‐Resistant Bacteria
Abstract
The development of antibiotic resistance among bacterial strains is a major global public health concern. To address this, drug‐free antibacterial approaches are needed. Copper surfaces have long been known for their antibacterial properties. In this work, a one‐step surface modification technique is used to assemble 2D copper chloride nanoplatelets directly onto copper surfaces such as copper tape, transmission electron microscopy (TEM) grids, electrodes, and granules. The nanoplatelets are formed using copper ions from the copper surfaces, enabling their direct assembly onto these surfaces in a one‐step process that does not require separate nanoparticle synthesis. The synthesis of the nanoplatelets is confirmed with TEM, scanning electron microscopy, energy dispersive spectroscopy (EDS), X‐ray diffraction (XRD), and Fourier transform infrared spectroscopy (FT‐IR). Antibacterial properties of the Cu nanoplatelets are demonstrated in multidrug‐resistant (MDR) Escherichia coli, MDR Acinetobacter baumannii, MDR Staphylococcus aureus, E. coli, and Streptococcus mutans. Nanoplatelets lead to a marked improvement in antibacterial properties compared to the copper surfaces alone, affecting bacterial cell morphology, preventing bacterial cell division, reducing their viability, damaging bacterial DNA, and altering protein expression. This work presents a robust method to directly assemble copper nanoplatelets onto any copper surface to imbue it with improved antibacterial properties.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Sep 01, 2022
- Source ID
- 10.1002/adhm.202102567
Entities
People
- Ayman Roslend
- Dipanjan Pan
- Ketan Dighe
- Maha Alafeef
- Mandy B. Esch
- Parikshit Moitra
- Parinaz Fathi
Organizations
- National Institute of Standards and Technology
- National Institutes of Health
- Pennsylvania State University
- United States Department of Defense
- University of Illinois Urbana–Champaign