Assembly and Electronic Applications of Colloidal Nanomaterials
Abstract
Artificial solids and thin films assembled from colloidal nanomaterials give rise to versatile properties that can be exploited in a range of technologies. In particular, solution‐based processes allow for the large‐scale and low‐cost production of nanoelectronics on rigid or mechanically flexible substrates. To achieve this goal, several processing steps require careful consideration, including nanomaterial synthesis or exfoliation, purification, separation, assembly, hybrid integration, and device testing. Using a ubiquitous electronic device – the field‐effect transistor – as a platform, colloidal nanomaterials in three electronic material categories are reviewed systematically: semiconductors, conductors, and dielectrics. The resulting comparative analysis reveals promising opportunities and remaining challenges for colloidal nanomaterials in electronic applications, thereby providing a roadmap for future research and development.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Nov 15, 2016
- Source ID
- 10.1002/adma.201603895
Entities
People
- Jian Zhu
- Mark Hersam
Organizations
- National Science Foundation
- Northwestern University
- Office of Naval Research