Electronic Skin: Recent Progress and Future Prospects for Skin‐Attachable Devices for Health Monitoring, Robotics, and Prosthetics

Abstract

Recent progress in electronic skin or e‐skin research is broadly reviewed, focusing on technologies needed in three main applications: skin‐attachable electronics, robotics, and prosthetics. First, since e‐skin will be exposed to prolonged stresses of various kinds and needs to be conformally adhered to irregularly shaped surfaces, materials with intrinsic stretchability and self‐healing properties are of great importance. Second, tactile sensing capability such as the detection of pressure, strain, slip, force vector, and temperature are important for health monitoring in skin attachable devices, and to enable object manipulation and detection of surrounding environment for robotics and prosthetics. For skin attachable devices, chemical and electrophysiological sensing and wireless signal communication are of high significance to fully gauge the state of health of users and to ensure user comfort. For robotics and prosthetics, large‐area integration on 3D surfaces in a facile and scalable manner is critical. Furthermore, new signal processing strategies using neuromorphic devices are needed to efficiently process tactile information in a parallel and low power manner. For prosthetics, neural interfacing electrodes are of high importance. These topics are discussed, focusing on progress, current challenges, and future prospects.

Document Details

Document Type
Pub Defense Publication
Publication Date
Sep 19, 2019
Source ID
10.1002/adma.201904765

Entities

People

  • Jaewan Mun
  • Jun Chang Yang
  • Se Young Kwon
  • Seongjun Park
  • Steve Park
  • Zhenan Bao

Organizations

  • Air Force Office of Scientific Research
  • KAIST
  • Stanford University

Tags

Readers

  • Distributed Systems and Data Platform Development
  • Robotics and Automation.
  • Systems Analysis and Design

Technology Areas

  • AI & ML
  • AI & ML - DoD AI Strategy
  • Autonomy
  • Microelectronics