Assembly of Foldable 3D Microstructures Using Graphene Hinges

Abstract

Origami/kirigami‐inspired 3D assembly approaches have recently attracted attention for a variety of applications, such as advanced optoelectronic devices and biomedical sensors. The results reported here describe an approach to construct classes of multiple foldable 3D microstructures that involve deformations that typical conductive materials, such as conventional metal films, cannot tolerate. Atomically thin graphene sheets serve as folding hinges during a process of 2D to 3D conversion via a deterministic buckling process. The exceptional mechanical properties of graphene enable the controlled, geometric transformation of a 2D precursor bonded at selective sites on a prestretched elastomer into folded 3D microstructures, in a reversible manner without adverse effects on the electrical properties. Experimental and computational investigations of the folding mechanisms for such types of 3D objects reveal the underlying physics and the dependence of the process on the thickness of the graphene/supporting films that define the hinges.

Document Details

Document Type
Pub Defense Publication
Publication Date
May 27, 2020
Source ID
10.1002/adma.202001303

Entities

People

  • Haiwen Luan
  • John A. Rogers
  • Jong-Hyun Ahn
  • Seungyun Lim
  • Shiwei Zhao
  • Yihui Zhang
  • Yonggang Huang
  • Yongjun Lee

Organizations

  • Army Research Office
  • Beihang University
  • National Natural Science Foundation of China
  • National Research Foundation of Korea
  • National Science Foundation
  • Northwestern University
  • Tsinghua National Laboratory for Information Science and Technology
  • Tsinghua University
  • Yonsei University

Tags

Readers

  • Integrated Circuit Design and Technology.
  • Quantum Dot Semiconductor Device Photonics and Graphene Optoelectronic Materials and THz Physics.
  • Systems Analysis and Design

Technology Areas

  • Biotechnology
  • Microelectronics
  • Microelectronics - Graphene
  • Microelectronics - Microelectromechanical Systems