Polymer Composites Containing Phase‐Change Microcapsules Displaying Deep Undercooling Exhibit Thermal History‐Dependent Mechanical Properties

Abstract

Microencapsulated materials are receiving broad attention for applications as diverse as energy storage and conversion, biomedicine, self‐healing materials, and electronics. Here, a general microfluidic approach is presented to prepare phase‐change material‐infilled microcapsules with unique thermal and mechanical properties. Aqueous sodium acetate solutions are encapsulated by an acrylate‐based shell via a microfluidic method. To understand and optimize microcapsule formation, flow behavior during the encapsulation is numerically simulated. When the microcapsules are embedded in an acrylate matrix (same composition as the shell wall material), the microcapsules exhibit a significant 46.6 ºC difference between the crystallization and melting temperatures as determined by differential scanning calorimetry at a rate of 10 ºC per min. Variable temperature dynamic mechanical analysis over the range of 50 to ‐90 ºC reveals up to a 50% change in the composite's elastic modulus at a given temperature, depending on if the sample is being cooled or heated, due to significant undercooling of the core material crystallization as shown by X‐ray diffraction.

Document Details

Document Type
Pub Defense Publication
Publication Date
Aug 14, 2020
Source ID
10.1002/admt.202000286

Entities

People

  • Jinjin Li
  • Jinyun Liu
  • Jonathan R. Streufert
  • Kai Mu
  • Paul V Braun
  • Tianli Han
  • Ting Si
  • Xirong Lin
  • Yanqiang Han

Organizations

  • Anhui Normal University
  • National Natural Science Foundation of China
  • Shanghai Jiao Tong University
  • United States Army
  • United States Department of Defense
  • University of Illinois Urbana–Champaign
  • University of Science and Technology of China

Tags

Fields of Study

  • Materials science

Readers

  • Molecular and Cellular Biochemistry
  • Surface Coatings Technology.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics