High‐Temperature Oxidation‐Resistant Printed Copper Conductors
Abstract
Advanced materials, electrically conductive and oxidation resistant, are frontrunners for technological advancements in cutting‐edge high‐temperature electronics. Rational design and manufacturing of hierarchical material structures is indispensable to achieve such disparate functionalities. Here, high‐temperature copper–graphene conductors, through additive manufacturing, which prohibits oxygen adsorbates and serves as the barrier for oxygen migration to enable electric stability and reliability at high temperatures, are reported. The combination of graphene and alumina surface passivation enables the electric stability of copper–graphene under thermal impact above 1000 °C. The findings shown here, the synergistic combination of high conductivity and oxidation resistance, enunciate the passivation capabilities for additively manufactured flexible electronics operating under harsh conditions.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Dec 21, 2022
- Source ID
- 10.1002/aelm.202200979
Entities
People
- Aaron Sheng
- Cheng‐gang Zhuang
- Chi Zhou
- Firas Alshatnawi
- Jason Armstrong
- Jian Yu
- Mark Poliks
- Mohammed Alhendi
- Saurabh Khuje
- Shenqiang Ren
- Yulong Huang
Organizations
- Air Force Research Laboratory
- Binghamton University
- United States Army Research Laboratory
- University at Buffalo