BLAST: A Wafer‐Scale Transfer Process for Heterogeneous Integration of Optics and Electronics
Abstract
A general transfer method is presented for the heterogeneous integration of different photonic and electronic materials systems and devices into a single substrate. Called BLAST, for Bond, Lift, Align, and Slide Transfer, the process works at wafer scale and offers precision alignment, high yield, varying topographies, and suitability for subsequent lithographic processing. BLAST's capabilities is demonstrated by integrating both GaAs and GaN µLEDs with silicon photovoltaics to fabricate optical wireless integrated circuits that up‐convert photons from the red to the blue. The study also shows that BLAST can be applied to a variety of other devices and substrates, including CMOS electronics, vertical cavity surface emitting lasers (VCSELs), and 2D materials. BLAST further enables the modularization of optoelectronic microsystems, where optical devices fabricated on one material substrate can be lithographically integrated with electronic devices on a different substrate in a scalable process.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Nov 01, 2023
- Source ID
- 10.1002/aelm.202300438
Entities
People
- Alejandro J. Cortese
- Alyosha C. Molnar
- Conrad L Smart
- Paul McEuen
- Yanxin Ji
Organizations
- Air Force Office of Scientific Research
- Cornell University
- Cornell University College of Arts and Sciences
- National Science Foundation