Rapid, On‐Command Debonding of Stimuli‐Responsive Cross‐Linked Adhesives by Continuous, Sequential Quinone Methide Elimination Reactions
Abstract
Adhesives that selectively debond from a surface by stimuli‐induced head‐to‐tail continuous depolymerization of poly(benzyl ether) macro‐cross‐linkers within a poly(norbornene) matrix are described. Continuous head‐to‐tail depolymerization provides faster rates of response than can be achieved using a small‐molecule cross‐linker, as well as responses to lower stimulus concentrations. Shear‐stress values for glass held together by the adhesive reach 0.51±0.10 MPa, whereas signal‐induced depolymerization via quinone methide intermediates reduces the shear stress values to 0.05±0.02 MPa. Changing the length of the macro‐cross‐linkers alters the time required for debonding, and thus enables the programmed sequential release of specific layers in a glass composite material.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Sep 08, 2015
- Source ID
- 10.1002/ange.201506511
Entities
People
- Hemakesh Mohapatra
- Hyungwoo Kim
- Scott T. Phillips
Organizations
- Army Research Office