Polymer multilayer films for high temperature capacitor application
Abstract
Advanced film capacitors require polymers with high thermal stability, high breakdown strength, and low loss for high temperature dielectric applications. To fulfill such requirements, two polymer multilayer film systems were coextruded via the forced assembly technique. High glass transition temperature (T g) polycarbonate (HTPC, Tg = 165 °C) and polysulfone (PSF, Tg = 185 °C) were multilayered with a high dielectric constant polymer, poly(vinylidene fluoride) (PVDF), respectively. The PSF/PVDF system was more thermally stable than the HTPC/PVDF system because of the higher Tg for PSF. At temperatures lower than 170 °C, the HTPC/PVDF system exhibited comparable breakdown strength and hysteresis loss as the PSF/PVDF system. While at temperatures above 170 °C, the PSF/PVDF system exhibited a higher breakdown strength because of the higher Tg of PSF. The electric displacement‐electric field (D‐E) loop behavior of the PSF/PVDF system was studied as a function of temperature. Moreover, a melt‐recrystallization process could further decrease the hysteresis loss for the PSF/PVDF system due to better edge‐on crystal orientation. These results demonstrate that PSF/PVDF and HTPC/PVDF systems are applicable for high temperature film capacitors. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47535.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jan 16, 2019
- Source ID
- 10.1002/app.47535
Entities
People
- Andrew Olah
- Ci Zhang
- Donald E. Schuele
- Eric Baer
- Jingwei Zhang
- Jingxing Feng
- Kezhen Yin
- Lei Zhu
- Xinyue Chen
- Zhenpeng Li
Organizations
- Case Western Reserve University
- National Science Foundation
- Office of Naval Research