POSS‐inducedrheological and dielectric modification of polyethersulfone
Abstract
Polyhedral oligomeric silsesquioxane (POSS) nanostructured chemicals, when incorporated at low levels in thermoplastics, provide processability enhancement and viscosity reduction without compromising other bulk physical properties. POSS has been relatively unexplored in high performance polymers, and there is incomplete understanding of the mechanisms by which POSS produces flow improvements. In this study, polyethersulfone (PES) was melt‐blended with trisilanolphenyl (TSP)‐POSS and dodecaphenyl (DP)‐POSS; and rheological, dielectric spectroscopy, and scanning electron microscopy evaluations were conducted to identify structure/property/processing relationships. TSP‐POSS yielded greater processability improvements and viscosity reductions than DP‐POSS, suppressed low temperature relaxations to a larger extent, and displayed a greater degree of nanoscale dispersion in the polymer matrix. The findings are evaluated in terms of competing theories of POSS viscosity reduction.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Feb 08, 2021
- Source ID
- 10.1002/app.50537
Entities
People
- Beibei Chen
- Jacob A. Cross
- Jin Gyu Park
- John K. Newman
- Lisa K. Kemp
- Nicholas Smith
- Rahul Shankar
- Sarah E Morgan
- Sergei I. Nazarenko
- Travis L. Thornell
Organizations
- Engineer Research and Development Center
- Florida State University
- University of Southern Mississippi