Techniques to reduce thermal resistance in flip‐chip GaN‐based VCSELs
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jun 19, 2017
- Source ID
- 10.1002/pssa.201600819
Entities
People
- Daniel Cohen
- Daniel Feezell
- John J. Leonard
- Saadat Mishkat‐ul‐masabih
- Shuji Nakamura
Organizations
- Defense Advanced Research Projects Agency