Effect of Intermetallic Content on Shear Deformation of Thin Sn-3.0Ag-0.5Cu Solder Micro-joints Between Copper Substrates
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jun 20, 2018
- Source ID
- 10.1007/s11664-018-6434-z
Entities
People
- I. Dutta
- P. Ajay Kumar
Organizations
- Missile Defense Agency