A Model for Intermetallic Growth in Thin Sn Joints Between Cu Substrates: Application to Solder Microjoints

Document Details

Document Type: Pub Defense Publication
Publication Date: Feb 27, 2020
Source ID: 10.1007/s11664-020-08019-8

Entities

People

B. Datta
Hong-Tao Yang
I. Dutta
P. A. Kumar
Y. Arafat

Organizations

Missile Defense Agency