Tensile and compressive stresses in Cu/W multilayers: Correlation with microstructure, thermal stability, and thermal conductivity

Document Details

Document Type
Pub Defense Publication
Publication Date
Nov 01, 2022
Source ID
10.1016/j.actamat.2022.118315

Entities

People

  • Claudia Cancellieri
  • D. Ariosa
  • Eric R. Hoglund
  • Giacomo Lorenzin
  • John A Tomko
  • Lars P.h. Jeurgens
  • Md Shafkat Bin Hoque
  • Patrick E Hopkins

Organizations

  • Army Research Office
  • Semiconductor Research Corporation
  • Swiss National Science Foundation