Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

Document Details

Document Type
Pub Defense Publication
Publication Date
Aug 01, 2018
Source ID
10.1016/j.engfracmech.2018.07.004

Entities

People

  • Patrick B. Thompson
  • Richard Johnson
  • Siva P.v. Nadimpalli

Organizations

  • New Jersey Institute of Technology
  • United States Department of Defense