A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

Document Details

Document Type
Pub Defense Publication
Publication Date
Feb 01, 2018
Source ID
10.1016/j.ijheatmasstransfer.2017.10.015

Entities

People

  • David B. Janes
  • Dimitrios Peroulis
  • Doosan Back
  • Justin A Weibel
  • Kevin P. Drummond
  • Michael D. Sinanis
  • Suresh Garimella

Organizations

  • Defense Advanced Research Projects Agency

Tags

Technology Areas

  • Microelectronics