The influence of deposition parameters on the stress evolution of sputter deposited copper

Document Details

Document Type
Pub Defense Publication
Publication Date
Jan 01, 2019
Source ID
10.1016/j.surfcoat.2018.10.059

Entities

People

  • Eric Chason
  • Gregory B. Thompson
  • Tyler Kaub
  • Zhaoxia Rao

Organizations

  • Army Research Office
  • European Commission
  • National Science Foundation