Conformal Cu–CuNi Thermocouple Using Particle-Free Ink Materials

Document Details

Document Type
Pub Defense Publication
Publication Date
Oct 25, 2022
Source ID
10.1021/acsaelm.2c01150

Entities

People

  • Aaron Sheng
  • Jian Yu
  • Saurabh Khuje
  • Shenqiang Ren
  • Zheng Li

Organizations

  • Air Force Research Laboratory
  • United States Army Research Laboratory
  • University at Buffalo