Three-Dimensional Graphene Foam–Polymer Composite with Superior Deicing Efficiency and Strength

Document Details

Document Type
Pub Defense Publication
Publication Date
Jan 26, 2018
Source ID
10.1021/acsami.7b18346

Entities

People

  • Arvind Agarwal
  • Benjamin Boesl
  • Cheng Zhang
  • Jenniffer Bustillos

Organizations

  • Florida International University
  • United States Department of Defense

Tags

Technology Areas

  • Microelectronics