High Thermal Boundary Conductance across Bonded Heterogeneous GaN–SiC Interfaces

Document Details

Document Type
Pub Defense Publication
Publication Date
Aug 13, 2019
Source ID
10.1021/acsami.9b10106

Entities

People

  • Bin Xu
  • Fengwen Mu
  • Jingjing Shi
  • Junichiro Shiomi
  • Samuel Graham
  • Seongbin Shin
  • Tadatomo Suga
  • Zhe Cheng

Organizations

  • Japan Society for the Promotion of Science
  • Meisei University
  • Ministry of Internal Affairs and Communications
  • Office of Naval Research
  • University of Tokyo
  • Waseda University