Copper Nanoplates for Printing Flexible High-Temperature Conductors

Document Details

Document Type
Pub Defense Publication
Publication Date
Feb 22, 2022
Source ID
10.1021/acsanm.2c00019

Entities

People

  • Aaron Sheng
  • Cheng-gang Zhuang
  • Jeng-yuan Tsai
  • Jian Yu
  • Lanrik Kester
  • Lu An
  • Qimin Yan
  • Saurabh Khuje
  • Shenqiang Ren
  • Thomas Parker
  • Yulong Huang
  • Zheng Li

Organizations

  • Air Force Research Laboratory
  • Temple University
  • United States Army Research Laboratory
  • University at Buffalo