Low-Temperature Copper Bonding Strategy with Graphene Interlayer

Document Details

Document Type
Pub Defense Publication
Publication Date
Jan 25, 2018
Source ID
10.1021/acsnano.7b07739

Entities

People

  • Anmin Hu
  • Cong Su
  • Fengtian Hu
  • Haozhe Wang
  • Jing Kong
  • Ju Li
  • Longlong Ju
  • Ming Li
  • Wei Sun Leong
  • Yukun Guo

Organizations

  • Air Force Office of Scientific Research
  • Division of Electrical, Communications & Cyber Systems
  • Massachusetts Institute of Technology
  • National Natural Science Foundation of China
  • Shanghai Jiao Tong University

Tags

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene