Entanglement across separate silicon dies in a modular superconducting qubit device
Abstract
Assembling future large-scale quantum computers out of smaller, specialized modules promises to simplify a number of formidable science and engineering challenges. One of the primary challenges in developing a modular architecture is in engineering high fidelity, low-latency quantum interconnects between modules. Here we demonstrate a modular solid state architecture with deterministic inter-module coupling between four physically separate, interchangeable superconducting qubit integrated circuits, achieving two-qubit gate fidelities as high as 99.1 ± 0.5% and 98.3 ± 0.3% for iSWAP and CZ entangling gates, respectively. The quality of the inter-module entanglement is further confirmed by a demonstration of Bell-inequality violation for disjoint pairs of entangled qubits across the four separate silicon dies. Having proven out the fundamental building blocks, this work provides the technological foundations for a modular quantum processor: technology which will accelerate near-term experimental efforts and open up new paths to the fault-tolerant era for solid state qubit architectures.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Sep 28, 2021
- Source ID
- 10.1038/s41534-021-00484-1
Entities
People
- Alysson Gold
- Andrew Bestwick
- Ani Nersisyan
- Anna Stockklauser
- Ben Scharmann
- Biswajit Sur
- Chad Rigetti
- Cody James Winkleblack
- Davide Venturelli
- Eyob A. Sete
- Feyza Oruc
- Filip Wudarski
- J. P. Paquette
- Mahabubul Alam
- Matthew J. Reagor
- Mike Harburn
- Nicolas Didier
- Seyed Armin Razavi
Organizations
- Rigetti Computing
- United States Department of Defense