Thermal boundary conductance enhancement using experimentally achievable nanostructured interfaces – analytical study combined with molecular dynamics simulation
Abstract
An analytical study demonstrates that SiC/GaN interfaces with square-shape nanopillar arrays enhance thermal boundary conductance, extendable to any characteristic lengths.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jan 01, 2016
- Source ID
- 10.1039/c6cp01927g
Entities
People
- Eungkyu Lee
- Ming Hu
- Teng Zhang
- Tengfei Luo
Organizations
- Defense Advanced Research Projects Agency
- National Science Foundation
- RWTH Aachen University
- United States Army
- University of Notre Dame