Thiol–epoxy/maleimide ternary networks as softening substrates for flexible electronics
Abstract
Thiol–epoxy/maleimide ternary thermosetting networks are prepared and characterized in vitro as responsive substrates for applications in bioelectronic medicines.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jan 01, 2016
- Source ID
- 10.1039/c6tb01082b
Entities
People
- Aaron Weittenhiller
- Andrew Wei
- Haley Abitz
- Melanie Ecker
- Milan Ho
- Neel Reddy
- Nicole Aragon
- Radu Reit
- Shelbi Parker
- Tong Kang
- Walter E. Voit
Organizations
- Defense Advanced Research Projects Agency
- National Science Foundation Directorate for Engineering
- United States Army
- University of Texas at Dallas