Competing failure modes in finite adhesive pads
Abstract
Thin adhesive pads used to attach objects to each other often fail catastrophically. In this study we consider the nature of failure of such pads and show that two different peeling mechanisms emerge.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jan 01, 2018
- Source ID
- 10.1039/c7sm02378b
Entities
People
- Chon U Chan
- Lakshminarayanan Mahadevan
- Tal Cohen
Organizations
- Agency for Science, Technology and Research
- Army Research Office
- Division of Materials Research
- Harvard University
- John D. and Catherine T. MacArthur Foundation
- National Science Foundation
- United States Army
- University of Cambridge