Kinetically controlled, adhesiveless transfer printing using microstructured stamps
Abstract
This letter describes the physics and application of an approach to transfer printing that uses stamps with microstructures of relief embossed into their surfaces. Experimental measurement of velocity-dependent adhesive strength as a function of relief geometry reveals key scaling properties and provides a means for comparison to theoretical expectation. Formation of transistor devices that use nanoribbons of silicon transfer printed directly onto glass substrates without adhesive layers demonstrates the use of this type of approach for a high-performance (mobilities >325 cm2/V s and on/off ratios >105) single crystal silicon on glass technology.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Mar 16, 2009
- Source ID
- 10.1063/1.3099052
Entities
People
- Andrew Carlson
- John A. Rogers
- Jong-Hyun Ahn
- Sang Min Won
- Shuodao Wang
- Tae-ho Kim
- Yonggang Huang
Organizations
- Northwestern University
- Sungkyunkwan University
- University of Illinois Urbana–Champaign