Impact of ultrathin Al2O3 barrier layer on electrical properties of LaLuO3 metal-oxide-semiconductor devices

Abstract

Temperature-dependent current-voltage measurements showed Poole–Frenkel conduction behavior through high-κ LaLuO3 films made by atomic layer deposition on Si. The energy levels that trap electrons were around 0.66 eV below the conduction band and were identified as oxygen vacancy levels. Oxygen treatments were done to decrease oxygen vacancies but an interfacial layer formed and the interface state density (Dit) increased. Therefore, ultrathin Al2O3 was used to protect the interface during oxygen treatments. Electrical properties were improved and no interfacial layer developed. Dit was below 9×1011 eV−1 cm−2 and leakage was 5×10−4 A/cm2 at 1 V for 1 nm equivalent oxide thickness.

Document Details

Document Type
Pub Defense Publication
Publication Date
Mar 21, 2011
Source ID
10.1063/1.3563713

Entities

People

  • Leonard J Brillson
  • Roy G. Gordon
  • Shaoping Shen
  • Yiqun Liu

Organizations

  • Harvard University
  • National Science Foundation
  • Office of Naval Research
  • Ohio State University

Tags

Fields of Study

  • Materials science

Readers

  • Molecular Photonics/Laser Physics
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene