Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly

Abstract

This letter describes the physics and application of an approach to transfer printing that utilizes targeted shear loading to modulate stamp adhesion in a controlled and repeatable fashion. Experimental measurements of pull-off forces as functions of shear and stamp dimension reveal key scaling properties and provide a means for comparison to theory and modeling. Examples of printed structures in suspended and multilayer configurations demonstrate some capabilities in micro/nanoscale materials assembly.

Document Details

Document Type
Pub Defense Publication
Publication Date
Jun 27, 2011
Source ID
10.1063/1.3605558

Entities

People

  • Andrew Carlson
  • Anton Kovalsky
  • Huanyu Cheng
  • Hyun-joon Kim-lee
  • Jian Wu
  • John A. Rogers
  • Kevin T. Turner
  • Paulius Elvikis
  • Placid M. Ferreira
  • Qingmin Yu
  • Steven Elgan
  • Yonggang Huang

Organizations

  • National Science Foundation
  • Northwestern Polytechnical University
  • Northwestern University
  • United States Department of Energy
  • University of Illinois Urbana–Champaign
  • University of Wisconsin–Madison

Tags

Readers

  • Nanofabrication and Microfabrication.
  • Quantum Dot Semiconductor Device Photonics and Graphene Optoelectronic Materials and THz Physics.
  • Structural Health Monitoring of Composite Structures.