Water absorption in thermally grown oxides on SiC and Si: Bulk oxide and interface properties

Abstract

We combine nuclear reaction analysis and electrical measurements to study the effect of water exposure (D2O) on the n-type 4H-SiC carbon face (0001¯) MOS system and to compare to standard silicon based structures. We find that: (1) The bulk of the oxides on Si and SiC behave essentially the same with respect to deuterium accumulation; (2) there is a significant difference in accumulation of deuterium at the semiconductor/dielectric interface, the SiC C-face structure absorbs an order of magnitude more D than pure Si; (3) standard interface passivation schemes such as NO annealing greatly reduce the interfacial D accumulation; and (4) the effective interfacial charge after D2O exposure is proportional to the total D amount at the interface.

Document Details

Document Type
Pub Defense Publication
Publication Date
Nov 10, 2014
Source ID
10.1063/1.4901719

Entities

People

  • Boris Yakshinskiy
  • Can Xu
  • G. Liu
  • Joseph Bloch
  • L. C. Feldman
  • Leszek Wielunski
  • Sarit Dhar
  • Torgny Gustafsson

Organizations

  • Auburn University
  • National Science Foundation
  • Rutgers University
  • United States Army Research Laboratory

Tags

Readers

  • Electrochemical Engineering/ Fuel Cell Technologies
  • Semiconductor Device Technology
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene