Role of Fe impurity complexes in the degradation of GaN/AlGaN high-electron-mobility transistors

Abstract

Recent experiments show that GaN/AlGaN high-electron-mobility transistors suffer from significant current collapse, which is caused by an increase in the concentration of traps with energy levels 0.5–0.6 eV below the conduction-band edge. This increase in trap concentration is consistent with thermally activated defect diffusion, but the responsible defect complexes have not been identified. It has been suggested that the defect complex may contain iron because of the proximity of the Fe-doped GaN substrate. Here, we report first-principles density-functional calculations of substitutional iron complexes, investigate their properties, and show that the FeGa-VN complex has properties that account for the observed degradation.

Document Details

Document Type
Pub Defense Publication
Publication Date
Feb 02, 2015
Source ID
10.1063/1.4907675

Entities

People

  • D. M. Fleetwood
  • Ronald D. Schrimpf
  • S. T. Pantelides
  • Y. S. Puzyrev

Organizations

  • Oak Ridge National Laboratory
  • Office of Naval Research
  • Vanderbilt University

Tags

Fields of Study

  • Materials science

Readers

  • Quantum Chemistry
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics