Thermal flux limited electron Kapitza conductance in copper-niobium multilayers
Abstract
We study the interplay between the contributions of electron thermal flux and interface scattering to the Kapitza conductance across metal-metal interfaces through measurements of thermal conductivity of copper-niobium multilayers. Thermal conductivities of copper-niobium multilayer films of period thicknesses ranging from 5.4 to 96.2 nm and sample thicknesses ranging from 962 to 2677 nm are measured by time-domain thermoreflectance over a range of temperatures from 78 to 500 K. The Kapitza conductances between the Cu and Nb interfaces in multilayer films are determined from the thermal conductivities using a series resistor model and are in good agreement with the electron diffuse mismatch model. Our results for the thermal boundary conductance between Cu and Nb are compared to literature values for the thermal boundary conductance across Al-Cu and Pd-Ir interfaces, and demonstrate that the interface conductance in metallic systems is dictated by the temperature derivative of the electron energy flux in the metallic layers, rather than electron mean free path or scattering processes at the interface.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Mar 02, 2015
- Source ID
- 10.1063/1.4913420
Entities
People
- Ajay K Yadav
- Amit Misra
- Edward S. Piekos
- John C. Duda
- John T. Gaskins
- Jon F. Ihlefeld
- Jon K. Baldwin
- Khalid Hattar
- Patrick E Hopkins
- Ramez Cheaito
- Thomas E. Beechem
Organizations
- Air Force Office of Scientific Research
- Los Alamos National Laboratory
- National Science Foundation
- Sandia National Laboratories
- University of California
- University of Michigan
- University of Virginia