Surfaces for high heat dissipation with no Leidenfrost limit

Abstract

Heat dissipation from hot surfaces through cooling droplets is limited by the Leidenfrost point (LFP), in which an insulating vapor film prevents direct contact between the cooling droplet and the hot surface. A range of approaches have been developed to raise this limit to higher temperatures, but the limit still exists. Recently, a surface architecture, decoupled hierarchical structure, was developed that allows the suppression of LFP completely. However, heat dissipation by the structure in the low superheat region was inferior to other surfaces and the structure required an extensive micro/nano fabrication procedure. Here, we present a metallic surface structure with no LFP and high heat dissipation capacity in all temperature ranges. The surface features the nucleate boiling phenomenon independent of the temperature with an approximate heat transfer coefficient of 20 kW m−2 K−1. This surface is developed in a one-step process with no micro/nano fabrication. We envision that this metallic surface provides a unique platform for high heat dissipation in power generation, photonics/electronics, and aviation systems.

Document Details

Document Type
Pub Defense Publication
Publication Date
Jul 10, 2017
Source ID
10.1063/1.4993775

Entities

People

  • Hadi Ghasemi
  • Nazanin Farokhnia
  • Peyman Irajizad
  • Seyed Mohammad Sajadi
  • Varun Kashyap

Organizations

  • Air Force Office of Scientific Research
  • University of Houston

Tags

Fields of Study

  • Physics

Readers

  • Combustion and Flow Dynamics.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene