Reticulated shallow etch mesa isolation for controlling surface leakage in GaSb-based infrared detectors

Abstract

Longwave infrared detectors using p-type absorbers composed of InAs-rich type-II superlattices (T2SLs) nearly always suffer from high surface currents due to carrier inversion on the etched sidewalls. Here, we demonstrate reticulated shallow etch mesa isolation (RSEMI): a structural method of reducing surface currents in longwave single-band and midwave/longwave dual-band detectors with p-type T2SL absorbers. By introducing a lateral shoulder to increase the separation between the n+ cathode and the inverted absorber surface, a substantial barrier to surface electron flow is formed. We demonstrate experimentally that the RSEMI process results in lower surface current, lower net dark current, much weaker dependence of the current on bias, and higher uniformity compared to mesas processed with a single deep etch. For the structure used, a shoulder width of 2 μm is sufficient to block surface currents.

Document Details

Document Type
Pub Defense Publication
Publication Date
Jul 31, 2017
Source ID
10.1063/1.4997172

Entities

People

  • C. L. Canedy
  • Chaffra A. Affouda
  • E. H. Aifer
  • E. R. Cleveland
  • Eric M. Jackson
  • Glenn G. Jernigan
  • I. Vurgaftman
  • J. R. Meyer
  • Jill A. Nolde
  • M. F. Bennett

Organizations

  • Office of Naval Research
  • United States Army
  • United States Naval Research Laboratory

Tags

Fields of Study

  • Materials science

Readers

  • Nanofabrication and Microfabrication.
  • Semiconductor Device Technology
  • Spectroscopy.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene