High coherence superconducting microwave cavities with indium bump bonding
Abstract
Low-loss cavities are important in building high-coherence superconducting quantum computers. Generating high-quality joints between parts is crucial for the realization of a scalable quantum computer using the circuit quantum electrodynamics (cQED) framework. In this paper, we adapt the technique of indium bump bonding to cQED to realize high-quality superconducting microwave joints between chips. We use this technique to fabricate compact superconducting cavities in the multilayer microwave integrated quantum circuit (MMIQC) architecture and achieve single photon quality factors over 300 × 106 or single-photon lifetimes approaching 5 ms. To quantify the performance of the resulting seam, we fabricate microwave stripline resonators in multiple sections connected by different numbers of bonds, resulting in a wide range of seam admittances. The measured quality factors combined with the designed seam admittances allow us to bound the conductance of the seam at gseam≥2×1010/(Ω m). Such a conductance should enable the construction of micromachined superconducting cavities with a quality factor of at least a billion. These results demonstrate the capability to construct very high-quality microwave structures within the MMIQC architecture.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Apr 13, 2020
- Source ID
- 10.1063/5.0003907
Entities
People
- Chan U. Lei
- Lev Krayzman
- Luigi Frunzio
- Robert J. Schoelkopf
- Suhas Ganjam
Organizations
- Army Research Office
- Yale University