Monitoring the Joule heating profile of GaN/SiC high electron mobility transistors via cross-sectional thermal imaging

Abstract

The development of high-quality gallium nitride (GaN) high electron mobility transistors (HEMTs) has provided opportunities for the next generation of high-performance radio frequency and power electronics. Operating devices with smaller length scales at higher voltages result in excessively high channel temperatures, which reduce performance and can have detrimental effects on the device's reliability. The thermal characterization of GaN HEMTs has traditionally been captured from either the top or bottom side of the device. Under this configuration, it has been possible to map the lateral temperature distribution across the device with optical methods such as infrared and Raman thermometry. Due to the presence of the gate metal, however, and often also the addition of a metal air bridge and/or field plate, the temperature of the GaN channel under the gate is typically inferred by numerical simulations. Furthermore, measuring the vertical temperature gradient across multiple epitaxial layers has shown to be challenging. This study proposes a new cross-sectional imaging technique to map the vertical temperature distribution in GaN HEMTs. Combining advanced cross-sectioning processing with the recently developed near bandgap transient thermoreflectance imaging technique, the full transient thermal distribution across a GaN HEMT is achieved. The cross-sectional thermal imaging of the GaN channel is used to study the effects of biasing on the Joule heating profile. Overall, the direct measurement of the GaN channel, capturing both the vertical and lateral gradient, will provide deeper insight into the device's degradation physics and supply further experimental data to validate previously developed electrothermal models.

Document Details

Document Type
Pub Defense Publication
Publication Date
Aug 21, 2020
Source ID
10.1063/5.0014407

Entities

People

  • Albert Hilton
  • Eric Heller
  • Georges Pavlidis
  • Jeff L. Brown
  • Samuel Graham

Organizations

  • Air Force Office of Scientific Research
  • Air Force Research Laboratory
  • Georgia Tech

Tags

Readers

  • Semiconductor Device Technology
  • Thermal Physics or Thermal Science.

Technology Areas

  • AI & ML
  • AI & ML - Bayesian Inference
  • Microelectronics