Method of growing elastically relaxed crack-free AlGaN on GaN as substrates for ultra-wide bandgap devices using porous GaN

Abstract

Crack-free 1.3 μm thick elastically relaxed AlxGa1−xN layers were demonstrated on compliant high fill-factor 10 × 10 μm2 tile patterned GaN-on-porous-GaN pseudo-substrates (PSs). Porous GaN was utilized as a semi-flexible underlayer. The AlxGa1−xN layer was grown in steps of 200, 300, 400, and 400 nm. While the AlxGa1−xN layer regrown on a co-loaded GaN-on-sapphire template cracked after deposition of only 200 nm AlGaN, on the GaN-on-porous GaN patterned substrates, no cracks were observed, and smooth films were achieved. In addition, an enhanced aluminum uptake was observed as the AlGaN growth progressed on the GaN-on-porous-GaN PS, owing to the composition pulling effect, until the point when the tiles started to coalesce. Upon further regrowth on these coalesced tiles, the aluminum uptake saturated, while the surface remained crack-free and smooth.

Document Details

Document Type
Pub Defense Publication
Publication Date
Aug 10, 2020
Source ID
10.1063/5.0017948

Entities

People

  • Chirag Gupta
  • Nirupam Hatui
  • S. Keller
  • Shubhra S Pasayat
  • Shuji Nakamura
  • Steven P. DenBaars
  • Umesh Mishra
  • Weiyi Li

Organizations

  • Office of Naval Research
  • University of California

Tags

Fields of Study

  • Materials science

Readers

  • Reinforced Composite Materials
  • Semiconductor Device Technology
  • Thin Film Deposition Science.