Ultrahigh vacuum packaging and surface cleaning for quantum devices
Abstract
We describe design, implementation, and performance of an ultra-high vacuum (UHV) package for superconducting qubit chips or other surface sensitive quantum devices. The UHV loading procedure allows for annealing, ultra-violet light irradiation, ion milling, and surface passivation of quantum devices before sealing them into a measurement package. The package retains vacuum during the transfer to cryogenic temperatures by active pumping with a titanium getter layer. We characterize the treatment capabilities of the system and present measurements of flux tunable qubits with an average T1 = 84 µs and T2echo=134 μs after vacuum-loading these samples into a bottom loading dilution refrigerator in the UHV-package.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Feb 01, 2021
- Source ID
- 10.1063/5.0034574
Entities
People
- Andreas Fuhrer
- Clemens Müller
- Jared Hertzberg
- M. Mergenthaler
- Markus Brink
- Martin O. Sandberg
- Peter R. Müeller
- S. Paredes
- Stefan Filipp
- V. P. Adiga
Organizations
- Intelligence Advanced Research Projects Activity
- International Business Machines Corporation (Armonk, NY)
- National Center of Competence in Research Quantum Science and Technology