Investigation and optimization of N-polar GaN porosification for regrowth of smooth hillocks-free GaN films
Abstract
This work investigates the process of planar electrochemical etching of pores in n-type nitrogen-polar GaN and the effect of pore morphology on regrown GaN film surface quality. An increase in the anodization voltage was found to increase the pore diameter and reduce the density of pores with inclined sidewalls near the surface of the porosified films. Simultaneously, a decrease in the hexagonal hillock size and number following GaN regrowth was observed. It is proposed that vertical pore sidewalls are essential to demonstrate high quality film coalescence. For smooth hillock-free 100 nm GaN regrowth, an optimal bias of 17 and 13 V for Ti-contacted N-polar GaN:Si with a Si doping of 4.5 × 1018 and 8 × 1018 cm−3, respectively, was found.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jul 26, 2021
- Source ID
- 10.1063/5.0049537
Entities
People
- Aidan A. Taylor
- Henry Collins
- Islam Sayed
- S. Keller
- Shubhra S Pasayat
- Umesh K. Mishra
- Weiyi Li
- Wenjian Liu
Organizations
- Office of Naval Research
- University of California, Santa Barbara