Simultaneous thickness and thermal conductivity measurements of thinned silicon from 100 nm to 17 μm
Abstract
Studies of size effects on thermal conductivity typically necessitate the fabrication of a comprehensive film thickness series. In this Letter, we demonstrate how material fabricated in a wedged geometry can enable similar, yet higher-throughput measurements to accelerate experimental analysis. Frequency domain thermoreflectance (FDTR) is used to simultaneously determine the thermal conductivity and thickness of a wedged silicon film for thicknesses between 100 nm and 17 μm by considering these features as fitting parameters in a thermal model. FDTR-deduced thicknesses are compared to values obtained from cross-sectional scanning electron microscopy, and corresponding thermal conductivity measurements are compared against several thickness-dependent analytical models based upon solutions to the Boltzmann transport equation. Our results demonstrate how the insight gained from a series of thin films can be obtained via fabrication of a single sample.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- May 17, 2021
- Source ID
- 10.1063/5.0050888
Entities
People
- Christopher B. Saltonstall
- Christopher Perez
- Darin Leonhardt
- David P. Adams
- Elbara Ziade
- Ethan A. Scott
- Kenneth E. Goodson
- Mehdi Asheghi
- Patrick E Hopkins
- V. Carter Hodges
Organizations
- Office of Naval Research
- Sandia National Laboratories
- Stanford University
- University of Virginia