Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics
Abstract
The ability to endow the surface of existing objects with desired electronic features enables many emerging applications such as Internet of Things (IoT). Despite significant progress in the optimization of thin-film materials and construction schemes, the realization of high-performance thin-film electronics on arbitrary place through a wafer-scale batch process is limited. This paper presents a wafer-recyclable, environment-friendly transfer printing process that enables the physical delivery of large-scale thin-film integrated circuits with various combinations of active nanomaterials from their fabrication wafer to nearly any kind of places. Detailed experimental and theoretical studies reveal the essential attributes of this approach. Demonstrations in electronics and sensors realized on the surface of commercial appliances to meet the user-specific needs illustrate the utility.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Jul 16, 2018
- Source ID
- 10.1073/pnas.1806640115
Entities
People
- Baoxing Xu
- Bongjoong Kim
- Chi Hwan Lee
- Dae Seung Wie
- Min Ku Kim
- Pedro P. Irazoqui
- Sangwook Park
- Xiaolin Zheng
- Young-joon Kim
- Yue Zhang
Organizations
- Air Force Research Laboratory Information Directorate
- National Science Foundation
- Purdue University
- Stanford University
- University of Virginia