Thermal cure effects on electromechanical properties of conductive wires by direct ink write for 4D printing and soft machines
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- Feb 23, 2017
- Source ID
- 10.1088/1361-665x/aa5cca
Entities
People
- Conner K. Dunn
- H. Jerry Qi
- Lei Wang
- Martin L. Dunn
- Quanyi Mu
- Tiejun Wang
Organizations
- Air Force Office of Scientific Research
- National Science Foundation