The 2021 flexible and printed electronics roadmap
Abstract
This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.
Document Details
- Document Type
- Pub Defense Publication
- Publication Date
- May 17, 2021
- Source ID
- 10.1088/2058-8585/abf986
Entities
People
- Andreas Distler
- Anjung Chung
- Benjamin Iniguez
- Christoph J. Brabec
- Corie L. Cobb
- Daniel Steingart
- Dongge Ma
- Gerd Grau
- Ghazaleh Haghiashtiani
- Gyoujin Cho
- Hans-Joachim Egelhaaf
- Huisheng Peng
- Jonathan Rivnay
- Junbiao Peng
- Kwang-ting Cheng
- Leilai Shao
- Ling Li
- Luisa Torsi
- Michael L. Chabinyc
- Michael McAlpine
- Muhammad M Hussain
- Robert A. Street
- Ronald Österbacka
- Shrayesh N Patel
- Taik-Min Lee
- Tricia Breen Carmichael
- Tse Nga Ng
- Tsung-ching Huang
- Vivek Subramanian
- Xiaojun Guo
- Yong Cao
- Yuguang Ma
- Yunyun Wu
- Yvan Bonnassieux
Organizations
- Air Force Research Laboratory
- Canadian Network for Research and Innovation in Machining Technology, Natural Sciences and Engineering Research Council of Canada
- Defense Advanced Research Projects Agency
- Division of Materials Research
- German Research Foundation
- Horizon 2020
- Ministry of Science and Technology, Israel
- National Institute of Biomedical Imaging and Bioengineering
- National Natural Science Foundation of China
- National Research Foundation of Korea
- Research Council of Finland